http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2004067774-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b19eaa8e535da4e4bceed99917a68153 |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-5399 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-34 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-36 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-62 |
| filingDate | 2002-08-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d90cbaa5dab53b15b212305dd18033b3 |
| publicationDate | 2004-03-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2004067774-A |
| titleOfInvention | Epoxy resin composition and semiconductor device |
| abstract | The present invention provides an epoxy resin composition for semiconductor encapsulation which is excellent in solder resistance and does not cause cracks or peeling from a substrate in a cured semiconductor device even in a solder treatment after moisture absorption, and a semiconductor device using the same. thing. SOLUTION: (A) epoxy resin, (B) phenol resin, (C) curing accelerator, (D) phosphazene compound, (E) silica and (F) γ-aminopropyltriethoxysilane, γ-aminopropyltriene An epoxy resin composition comprising at least one silane coupling agent selected from the group consisting of methoxysilane, γ-glycidylpropyltriethoxysilane, and γ-glycidylpropyltrimethoxysilane as an essential component, and (E) An epoxy resin composition for semiconductor encapsulation, wherein silica is subjected to a surface treatment using at least one or more silane coupling agents selected from the group (F). [Selection diagram] None |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2005263878-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2014159555-A |
| priorityDate | 2002-08-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 59.