http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2004058343-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_7acd9416af412b5972feb55a5e652ea2 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B27-34 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B15-20 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B27-38 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B15-092 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B15-088 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B15-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-03 |
| filingDate | 2002-07-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_18e4a66718eb57d0552bada6b9023f76 |
| publicationDate | 2004-02-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2004058343-A |
| titleOfInvention | Adhesive sheet for laminated board containing inner layer circuit and laminated board containing inner layer circuit using this adhesive sheet for laminated board containing inner layer circuit |
| abstract | An adhesive sheet for a laminated board with an inner layer circuit, which can secure sufficient rigidity even with a laminated sheet with an inner layer circuit using an adhesive sheet for an inner layer circuit with a heat-resistant film and a thermosetting resin layer. Thus, a laminated board with an inner layer circuit having sufficient rigidity is provided. In an adhesive sheet for a laminated board with an inner circuit in which an epoxy resin composition layer is formed on both sides of a heat-resistant film made of polyimide or aromatic polyamide, an inorganic filler is blended into the epoxy resin composition layer. This makes it possible to improve the rigidity of the laminated board with the inner layer circuit manufactured using this adhesive sheet, while also reducing the coefficient of thermal expansion. Furthermore, in a laminated board with an inner layer circuit formed by laminating and integrating such an adhesive sheet and an inner layer material having an inner layer circuit forming surface, the rigidity of the substrate is improved, while the coefficient of thermal expansion can be reduced. [Selection diagram] None |
| priorityDate | 2002-07-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 40.