http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2004056105-A

Outgoing Links

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assignee http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_be055db3c1a09879df07379ba969e223
classificationCPCAdditional http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48091
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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-56
filingDate 2003-05-23-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_cf7640233388866c6016ea1197197303
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publicationDate 2004-02-19-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2004056105-A
titleOfInvention Sealing tape supply device
abstract An object of the present invention is to provide a device suitable for mass production when performing resin sealing while attaching a sealing tape in a manufacturing process of a resin-sealed semiconductor device. A sealing die includes an upper die 151a and a lower die 151b. A lower die 151b has a large number of semiconductor product molding parts 160 (die cavities) and seals with each semiconductor product molding part 160. A sealing resin flow passage 161 for supplying the sealing resin is provided. Then, the sealing tape 152 is continuously unwound and wound while applying a constant tension between the unwinding roll 156a and the winding roll 156b. In addition, a roll moving mechanism or a θ correction mechanism is provided as a shift correction unit that moves one of the unwind roll 156a and the take-up roll 156b in a direction parallel to the roll axis direction. [Selection diagram] FIG.
priorityDate 2003-05-23-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

Incoming Links

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Total number of triples: 21.