| abstract |
A method of forming a circuit pattern, particularly using an electroless plating technique. A method of forming a circuit pattern includes at least (a) a step of forming a copper film by applying electroless copper plating on a nonconductor and (b) forming a circuit pattern by etching the copper film. At least the following (I), (II) and (III) are provided for providing a catalyst for the electroless copper plating: (I) silver colloid particles, (II) one or more ions of a metal having a potential capable of reducing silver ions to metallic silver in a solution and / or ions oxidized during the reduction of silver ions; (III) One or more of hydroxycarboxylic acid ions, condensed phosphate ions and / or amine carboxylic acid ions are contained as essential components, and the silver colloid particles of (I) are silver (II). A circuit pattern forming method characterized by using a silver colloid solution generated by ions of a metal having a potential capable of reducing ions to metallic silver. [Selection diagram] None |