| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_e415f6f1eeb8706d299ea086326248bf |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-121
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-09063
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0761 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-383
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-42
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-26
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-244 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-42
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-26
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-24 |
| filingDate |
2003-04-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_cd9385253b9a3f119bced13a63eed423
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8638edaf40ff8f5af0d7e38066af10d1
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_be7382d0eb670dee354ccf612a95d544 |
| publicationDate |
2004-02-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2004040082-A |
| titleOfInvention |
Manufacture of printed wiring boards |
| abstract |
An object of the present invention is to provide a method for efficiently manufacturing a printed wiring board having a non-plated through-hole and a flat and glossy printed wiring board. The method includes the steps of: (a) manufacturing a printed wiring board having a through hole in which a part of the through hole is not metal-plated; and (b) converting the printed wiring board into at least one organic sulfur containing a divalent sulfur atom having a carbon-sulfur single crystal. A manufacturing method comprising the steps of: washing with a washing bath containing a compound; c) microetching the washed printed wiring board; and d) electrolessly laminating a metal layer on the printed wiring board. [Selection diagram] None |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2006316350-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2007063661-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2013076171-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2013163867-A |
| priorityDate |
2002-04-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |