| abstract |
A pressure-sensitive adhesive sheet for processing semiconductors, which prevents generation of electrification during a semiconductor manufacturing process and prevents destruction and deterioration of a semiconductor device due to the electrification. The block copolymer comprises 25 to 75 parts by weight of a polypropylene, a polystyrene block (A) represented by the general formula (1), and a vinyl polyisoprene block (B) represented by the general formula (2). A film base comprising a mixture of 25 parts by weight and 1 to 30 parts by weight of a polymer type antistatic agent containing polyether as a main component, and an adhesive comprising a base polymer, a radiation polymerizable compound and a radiation polymerizable polymerization initiator Pressure-sensitive adhesive sheet for semiconductor substrate processing consisting of an agent layer. |