| abstract |
The present invention makes available new starting materials that enable the production of insulating polymers with low dielectric constant, high temperature stability and chemical stability. The present invention relates to a novel bis-o-aminophenol represented by the following formula I: Wherein M has the meaning of claim 1. This bis-o-aminophenol allows for the production of heat resistant polybenzoxazole. The bis-o-aminophenol is preferably formed from the corresponding diol, which is first nitrosated. Next, nitroso compounds, Pd / C, by hydrogenation using H 2, is reduced to the amino compound. [Selection diagram] None |