| abstract |
A method for reducing planar shrinkage in an LTCC ceramic tape laminate structure without the use of externally applied force or sacrificial restraining tape. Kind Code: A1 To reduce x, y shrinkage during firing of a green assembly comprising at least one layer of non-sacrificial restraining tape containing glass and at least one layer of primary tape containing glass. The method of claim 1, wherein the constraining tape and the primary tape are laminated to form an assembly, and wherein the tape layer of the assembly during thermal processing exhibits mutual suppression of x, y shrinkage. [Selection diagram] Fig. 1 |