http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2004022605-A

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filingDate 2002-06-12-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_baf61ede0bee8d79edccaeb612d50194
publicationDate 2004-01-22-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2004022605-A
titleOfInvention Wiring board
abstract A wiring board cannot be firmly joined to an external electric circuit board due to the rise of solder. An insulating base having an electronic component mounting portion and a frame-shaped metal layer surrounding the mounting portion on an upper surface, and having connection pads on an outer peripheral portion of a lower surface, and a side surface of the insulating base. A wiring board 7 including a castellation conductor 5 for connecting the connection pad 4 and the frame-shaped metal layer 3, wherein the castellation conductor 5 includes a first region 5 b derived from the connection pad 4 and a frame. A first region 5b and a second region 5c are formed inside the insulating substrate 1 while being displaced in the width direction of the side surface of the insulating substrate 1. The connection pad 4 is connected via the internal wiring layer 10, and the outer side of the connection pad 4 has a waveform. [Selection diagram] Fig. 1
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priorityDate 2002-06-12-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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Total number of triples: 21.