| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_03d0f52bb4069f8a19d70dcfb697c67a |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-2848
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-064
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-1394
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-0577 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-0094 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-26
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-004
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-40 |
| filingDate |
2002-06-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_382467da16a04499449ed13f6cf6485b |
| publicationDate |
2004-01-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2004020643-A |
| titleOfInvention |
Dry film resist and printed circuit board manufacturing method |
| abstract |
A dry film resist having a thin film and excellent tent strength is provided. A two-layer dry film resist 10 is coated on a support 11 and dried, and a first photoresist layer 14 sensitive to actinic radiation that can be developed with alkali, and further in a state of an aqueous dispersion emulsion thereon. A second photoresist layer 15 that is applied and dried and can be developed with an alkali sensitive to active energy rays, and a protective film laminated thereon. After the protective film is peeled off, the dry film resist 10 has a through hole 18 and is laminated with a hot roll on an insulating substrate 17 whose surface is covered with plated copper. At this time, the second photoresist layer 15 enters the through hole because of its high fluidity during heating. In addition, since the first photoresist layer 14 has low fluidity when heated, a decrease in film thickness at the edge portion of the through hole 18 is suppressed. [Selection] Figure 4 |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-7011047-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-WO2019187365-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2020195345-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2005081064-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-WO2020195345-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-7152593-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-107124826-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2014137538-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2019187365-A1 |
| priorityDate |
2002-06-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |