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filingDate 2002-06-19-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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publicationDate 2004-01-22-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2004017549-A
titleOfInvention Manufacturing method of carrier plate
abstract An object of the present invention is to provide a carrier plate having good productivity and extremely excellent dimensional stability. A molding die (11, 12, 13) that is opened and closed with a crack along a horizontal plane is preheated, and a plate body (1) on which an adhesive is applied in advance is horizontally disposed in the die (12). After injecting the additional silicone rubber 2 from the injection port 16 provided on the outer peripheral surface of the molding die 11 into a space in the molding die 12 formed on the outer periphery of the plate body 1, the additional silicone rubber 2 is removed. It is characterized in that the plate body 1 and the addition type silicone rubber 2 are bonded together while heating and vulcanizing. [Selection] Fig. 2
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2011178036-A
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Total number of triples: 31.