| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_129e393582e6bdf4029baf2206522f45 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24B37-22
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24B37-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24B37-24
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-304 |
| filingDate |
2002-06-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ebdefe4b67d949d56a03b6a52d338ef5
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_86617ac0bc0c7d86bfc0f0a1ad1e0266
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_13267843f12c61be6bf1c0c60236de2d |
| publicationDate |
2004-01-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2004014744-A |
| titleOfInvention |
Polishing pad, polishing apparatus, and polishing method using the same |
| abstract |
An object of the present invention is to provide a polishing pad which is easy to handle when replacing the polishing pad. In a polishing pad composed of an adhesive layer and another single layer or a plurality of layers, an interface between the adhesive layer and any other layer and an interface between the adhesive layer and a polishing platen are provided. A polishing pad characterized in that at least one interface has a 180-degree peeling adhesive strength of 1.0 N / cm or more and 6.5 N / cm or less. [Selection diagram] None |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2011000671-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2008207319-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2008544868-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2011183495-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-112238670-A |
| priorityDate |
2002-06-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |