http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2004010800-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b19eaa8e535da4e4bceed99917a68153 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-20 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-62 |
| filingDate | 2002-06-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_20b0512340a09710bece4542f86e2ff0 |
| publicationDate | 2004-01-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2004010800-A |
| titleOfInvention | Epoxy resin composition and semiconductor device |
| abstract | [PROBLEMS] To provide an epoxy resin composition for semiconductor encapsulation which does not contain a halogen-based flame retardant and an antimony compound and has excellent properties such as flame retardancy, fluidity and curability, solder resistance, and high-temperature storage properties. thing. An essential component is (A) a biphenyl type epoxy resin, (B) a phenol aralkyl resin, (C) a triazine-modified phenol novolak resin, (D) a curing accelerator, and (E) an inorganic filler. Epoxy resin composition for semiconductor encapsulation. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2009209317-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2005344081-A |
| priorityDate | 2002-06-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 37.