http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2004010654-A
Outgoing Links
Predicate | Object |
---|---|
assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b19eaa8e535da4e4bceed99917a68153 |
classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-5399 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-20 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-62 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-00 |
filingDate | 2002-06-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_002eeb0db7598e7baeed1d2b0e3e538b |
publicationDate | 2004-01-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber | JP-2004010654-A |
titleOfInvention | Epoxy resin composition and semiconductor device |
abstract | An epoxy resin composition for semiconductor encapsulation that does not contain a halogen-based flame retardant and an antimony compound and has excellent flame retardancy, high-temperature storage characteristics, and excellent solder resistance that can be used at 260 ° C., which is the mounting temperature of lead-free solder. Providing things. SOLUTION: (A) Dicyclopentadiene-modified phenol type epoxy resin (A-1), orthocresol novolak type epoxy resin (A-2), biphenyl type epoxy resin (A-3), (B) phenol resin, An epoxy resin composition comprising C) a curing accelerator, (D) an inorganic filler and (E) a phosphazene compound as essential components, wherein the weight ratio of the epoxy resin is (A-1) / [(A-1) + (A-2) + (A-3)] = 0.2 to 0.8, (A-2) / [(A-1) + (A-2) + (A-3)] = 0. 1 to 0.4, (A-3) / [(A-1) + (A-2) + (A-3)] = 0.1 to 0.4, for semiconductor encapsulation Epoxy resin composition. |
priorityDate | 2002-06-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 46.