http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2004010654-A

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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-5399
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filingDate 2002-06-04-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_002eeb0db7598e7baeed1d2b0e3e538b
publicationDate 2004-01-15-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2004010654-A
titleOfInvention Epoxy resin composition and semiconductor device
abstract An epoxy resin composition for semiconductor encapsulation that does not contain a halogen-based flame retardant and an antimony compound and has excellent flame retardancy, high-temperature storage characteristics, and excellent solder resistance that can be used at 260 ° C., which is the mounting temperature of lead-free solder. Providing things. SOLUTION: (A) Dicyclopentadiene-modified phenol type epoxy resin (A-1), orthocresol novolak type epoxy resin (A-2), biphenyl type epoxy resin (A-3), (B) phenol resin, An epoxy resin composition comprising C) a curing accelerator, (D) an inorganic filler and (E) a phosphazene compound as essential components, wherein the weight ratio of the epoxy resin is (A-1) / [(A-1) + (A-2) + (A-3)] = 0.2 to 0.8, (A-2) / [(A-1) + (A-2) + (A-3)] = 0. 1 to 0.4, (A-3) / [(A-1) + (A-2) + (A-3)] = 0.1 to 0.4, for semiconductor encapsulation Epoxy resin composition.
priorityDate 2002-06-04-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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