| abstract |
PROBLEM TO BE SOLVED: To adopt a thin and lightweight package. However, problems caused by warpage of the package due to the thinness and a difference in thermal expansion coefficient with the mounting substrate, such as disconnection of a conductive path provided in the semiconductor device and poor connection with a thin metal wire, cause a problem of the semiconductor device. Had a problem with reliability. A conductive path made of a crystal whose X-axis and Y-axis directions are larger than a Z-axis direction is embedded in an insulating resin, and the back surface of the conductive path is exposed and sealed from the insulating resin. Provided is a semiconductor device. Thereby, disconnection of the conductive path 40 embedded in the insulating resin 44 is suppressed. [Selection diagram] Fig. 1 |