| abstract |
An object of the present invention is to provide a packaging system that allows devices to be connected together without the limitations and limitations that exist in conventional packaging systems. The present invention provides a flexible interconnect package system. The system includes a flexible substrate material that includes internal traces connected to a fingerprint sensor mounted on the substrate. The bonding pads of the fingerprint sensor are connected to the conductive trace pads of the internal traces using techniques such as wire bonding, ball / bump methods, automatic tape bonding (TAB), or any other bonding method appropriate for integrated circuits. You. The final package includes a pre-molded package that forms an open space, which allows the sensor surface of the fingerprint sensor to be exposed for user access. [Selection diagram] FIG. |