http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2004006522-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c1755eede76ea7e719a3e0d2843cd793 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-304 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-301 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-68 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24B37-30 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-683 |
| filingDate | 2002-05-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6f9fbc08f172810e4d363236511b898d http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_97b5d9834cc3c21bebcd7ff124f283bd http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5b54196c18392457dc4984d7eb5aef80 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a49153df6022aaaf18d0957093a87ca7 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f25ecd782c46789a0c771c686e04c26b |
| publicationDate | 2004-01-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2004006522-A |
| titleOfInvention | IC chip manufacturing method |
| abstract | Provided is a method for manufacturing an IC chip which can prevent breakage of the wafer even if the wafer is extremely thin, having a thickness of about 50 μm, improve the handleability, and can favorably process the IC chip. At least a step (1) of forming a groove deeper than a completed chip thickness from a circuit pattern forming surface side along a dicing line of a wafer on which a circuit pattern is formed, by stimulating at least one surface. Step 2 of fixing the wafer to the support plate through a double-sided adhesive tape containing a gas generating agent that generates a gas, polishing the wafer to the thickness of a completed chip while fixing the wafer to the support plate and individually A method for producing an IC chip, comprising: a step 3 of separating the chip into chips; and a step 4 of applying a stimulus to the double-sided adhesive tape, wherein in the step 2 of fixing the wafer to the support plate via the double-sided adhesive tape, A method for manufacturing an IC chip in which a surface containing a gas generating agent is bonded to a surface of a wafer on which a circuit pattern is formed. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-4638172-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2005294536-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2010212474-A |
| priorityDate | 2002-05-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 97.