http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2004002495-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b19eaa8e535da4e4bceed99917a68153 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-62 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-30 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-20 |
| filingDate | 2002-04-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b00ac5c6f0882671cb07585e4ee619f9 |
| publicationDate | 2004-01-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2004002495-A |
| titleOfInvention | Epoxy resin composition and semiconductor device |
| abstract | An epoxy resin composition for semiconductor encapsulation having excellent flame retardancy and solder crack resistance without using a conventional flame retardant. SOLUTION: (A) a phenol aralkyl type epoxy resin having a biphenyl skeleton, (B) a bisphenol type epoxy resin having a sulfide structure, (C) a phenol aralkyl resin having a biphenyl skeleton represented by the general formula (3), and (D) curing An epoxy for semiconductor encapsulation, comprising an accelerator and (E) an inorganic filler as essential components, and having a weight ratio ((A) / (B)) of (A) / (B) of 1 to 10. Resin composition. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-4560526-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2008063555-A |
| priorityDate | 2002-03-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 33.