http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2003534646-A
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10S438-906 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-28556 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-67207 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76814 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C14-021 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02101 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02063 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-67167 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-67184 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-67028 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-28 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C16-0227 |
| classificationIPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-285 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-308 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-304 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C14-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-768 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C16-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-027 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-28 |
| filingDate | 2001-04-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2003-11-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2003534646-A |
| titleOfInvention | Metal deposition cluster tool including metal film deposition method and supercritical drying / cleaning module |
| abstract | (57) Abstract: A method of depositing a metal film on a substrate includes a supercritical preclean step, a supercritical desorption step, and a metal deposition step. Preferably, the precleaning step comprises maintaining supercritical carbon dioxide and a chelating agent in contact with the substrate to remove the oxide layer from the metal surface of the substrate. More preferably, the pre-clean step comprises maintaining supercritical carbon dioxide, chelating agent and acid in contact with the substrate. Alternatively, the pre-clean step involves maintaining the supercritical carbon dioxide and amine in contact with the oxide layer. The desorption step involves maintaining supercritical carbon dioxide in contact with the substrate to remove adsorbed material. The metal deposition step then comprises removing the metal film without exposing the substrate to a material that oxidizes the metal surface of the pre-cleaned substrate and exposing the substrate to non-volatile materials that are adsorbed to the substrate. Deposit on the substrate. Apparatus for depositing a metal film on a substrate includes a transfer module, a supercritical processing module, a vacuum module, and a metal deposition module. The supercritical processing module is connected to the transfer module. The vacuum module connects the metal deposition module to the transfer module. In operation, an apparatus for depositing a metal film performs a supercritical preclean step, a supercritical desorption step, and a metal deposition step. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2014099627-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2007073722-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101275373-B1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2004228526-A |
| priorityDate | 2000-04-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 95.