| abstract |
(57) [Summary]nA composition useful as an underfill sealant for connecting a semiconductor device to a circuit board can be reworked for easier separation from the semiconductor device, the composition comprising at least one oxirane or thiirane linking group. A curable resin having and substituted with an alkyl, alkenyl or aryl substituent at least three of the oxirane or thiirane carbon atoms, and a curing agent selected from anhydrides, amines, amides, imidazoles, and combinations thereof including. |