http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2003525752-A
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B24B53-017 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B24B37-26 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-304 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24B53-017 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24B53-007 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24B37-26 |
| filingDate | 1999-01-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2003-09-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2003525752-A |
| titleOfInvention | Groove cleaning device for chemical mechanical polishing |
| abstract | (57) An improved chemical mechanical polishing method and apparatus (11) are provided. A brush (13a) is used to continuously sweep slurry debris from surface features, such as grooves, on the polishing pad (17). This prevents the slurry from being compressed in the groove (19) as the slurry passes under the wafer polishing head (29) and receives its compressive force. The present invention uses a stationary brush (13a) that is operatively coupled to the polishing pad surface (17) or cleans the diamond surface (27a) and the surface features of the pad (17) that condition the polishing pad (17). It can be implemented with an improved conditioning assembly (23) having both brushes (13a). The brush portion of the conditioning assembly (23) may or may not rotate as it scans the entire surface of the polishing pad (17). |
| priorityDate | 1998-02-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
| Predicate | Subject |
|---|---|
| isDiscussedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID71961 http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID415749239 |
Total number of triples: 15.