| abstract |
(57) [Summary]nThe present invention provides a micro-machined structure with a durable anti-friction surface while they are still in the form of a wafer (ie, before breaking them into discrete devices for incorporation into a package). A method for forming is disclosed. The method involves depositing a material to form a low traction surface. It also discloses chemicals that are effective in imparting antistatic friction to the chip. These include polyphenylsiloxanes, phenylsiloxanes terminated with silanol groups, and similar materials. |