http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2003522406-A
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-67051 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B08B3-10 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23G1-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23G1-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02052 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25F1-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-67057 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-6704 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23G1-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25F1-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-304 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-306 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B08B3-10 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23G1-02 |
| filingDate | 2001-01-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2003-07-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2003522406-A |
| titleOfInvention | Method and apparatus for cleaning silicon wafer |
| abstract | (57) [Summary] The present invention is a method and an apparatus for electrically removing particles that can be effectively used for wet cleaning of a semiconductor wafer. The present invention provides an effective electric field that can substantially eliminate unacceptable 0.05 micron or less "killer defects" when manufacturing very sophisticated microtips with feature sizes or line widths less than 0.15 microns. The wafer surface is charged by an ampoule voltage sufficient to obtain strength. In the present invention, the voltage is frequently inverted. The present invention is directed to automatic wet bench cleaning operations using cassettes holding 10 to 50 wafers at a time, and various other uses using megasonic transducers, mechanical brush scrubbers, leather cleaners, CMP equipment, and the like. Applicable to washing operation. The method for electrically removing particles of the present invention primarily involves the use of large wafers 200-400 millimeters in diameter that require 250-350 steps including dry layering, patterning, doping, and at least 30 wet cleaning steps. It is intended for fab factories to be processed. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2006319282-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2005322872-A |
| priorityDate | 2000-01-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 47.