| Predicate |
Object |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/A61K35-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C12N2501-395
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C12N2501-11
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D7-123
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C12N2500-40
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D17-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C12N2500-25
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C12N2500-34
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C12N2500-32
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C12N2506-22
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C12N2501-39 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-2885
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D17-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D17-001 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/A61K35-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D5-08 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D7-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D17-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-288
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-16
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C28-00 |
| filingDate |
1999-07-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate |
2003-07-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2003520898-A |
| titleOfInvention |
Method and apparatus for performing copper plating using chemical plating and electroplating |
| abstract |
(57) Abstract A reactor (20) for plating metal on the surface of a workpiece (25) is described. The reactor (20) includes a reactor bowl (35) containing an electroplating solution, and an anode (55) disposed in the reactor bowl in contact with the electroplating solution. A contact assembly (85) is spaced from the anode (55) in the reactor bowl (35). The contact assembly has a plurality of contacts (not shown) arranged to contact a periphery of a surface of the workpiece to provide electroplating power to the workpiece. The contact in the form of a flat ring or a separate bend performs a wiping action on the surface of the workpiece when the fork piece contacts the contact. The contact assembly also has a barrier (not shown) located within the plurality of contacts. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-7194305-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2013064196-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9512538-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10053792-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2020132946-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8277624-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-7256027-B2 |
| priorityDate |
1998-07-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |