| Predicate |
Object |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B82Y30-00 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-293
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L101-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L101-02 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L101-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-00 |
| filingDate |
2000-11-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate |
2003-06-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2003518187-A |
| titleOfInvention |
Encapsulant composition having thermal shock resistance |
| abstract |
(57) [Summary]nAn electronic component comprising a non-silicone oligomer having a glass transition temperature lower than 0 ° C. and having a flexible hydrocarbon main chain having a reactive functionality, up to 40% by weight of a fixing agent, and an optional viscosity adjusting component. Thermomechanical impact resistant cured composition for encapsulating a solvent-free hydrophobic resin. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-5143020-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2008069179-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2008069178-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2010177679-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2009508981-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2007504336-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8217275-B2 |
| priorityDate |
1999-12-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |