| abstract |
PROBLEM TO BE SOLVED: To provide a method and an apparatus capable of simultaneously depositing a connection material between IC components and flattening a wafer in IC wafer manufacturing. A deposition / polishing system includes a wafer holder, a polishing pad mechanism, and a CMP plating tank. The CMP plating tank 235 is a container for storing a solution 238 used for plating such as electroplating and chemical plating for depositing a metal material such as copper on the wafer 224. The wafer 224 is immersed in a plating solution 238 in a plating bath 235, and while the metal material is being deposited on the surface of the wafer 224, the polishing pad mechanism 230 performs deposition on an area of the wafer surface such as the interconnect trench 225. Delay. The polishing pad mechanism 230 further agitates the plating solution 238 and promotes flow to the wafer. |