http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2003504869-A
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-7684 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76843 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-53238 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76873 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76879 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-3205 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-52 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-768 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-532 |
| filingDate | 2000-07-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2003-02-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2003504869-A |
| titleOfInvention | Fabrication process for CU damascene structure without dishing |
| abstract | Abstract: Fabrication of copper damascene wiring includes depositing an oxide layer (304) on an underlying conductive layer (102), such as a substrate or a metal layer, which is then patterned. Is etched. Next, a barrier layer (308) with an optional copper seed layer is deposited on the patterned oxide layer (304). The barrier layer (308) is patterned and etched to remove some of the barrier material. Plate copper (318) on the barrier layer (308). CMP polishing is performed to bring the copper layer (318) to the level of the barrier layer (308). Polishing is continued, further polishing the barrier layer (308) and any remaining copper (318) to the level of the oxide layer (304). The result is a copper damascene structure without dishing. |
| priorityDate | 1999-07-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
| Predicate | Subject |
|---|---|
| isDiscussedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID23978 http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID418354341 |
Total number of triples: 19.