| Predicate |
Object |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L79-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-40
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L87-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08J7-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 |
| filingDate |
2000-05-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate |
2003-01-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2003500509-A |
| titleOfInvention |
High performance cyanate-bismaleimide-epoxy resin compositions for printed circuits and encapsulants |
| abstract |
(57) [Summary]nCompositions useful as encapsulants for electronic components and dielectric layers on printed circuits with microvias combine the advantages of each component and co-curing agents with cyanate esters, bismaleimides, unsaturated aliphatic and glycidyl moieties The weakness of the other component is compensated by mixing the epoxy resin and optionally a free radical initiator. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2012512312-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101318456-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2017095599-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2017088745-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I418592-B |
| priorityDate |
1999-05-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |