| abstract |
PROBLEM TO BE SOLVED: To provide a method for bonding an IC chip to a substrate with a non-conductive adhesive, which has improved the disadvantages or disadvantages of the conventional bonding method. A method of bonding an IC chip with a non-conductive adhesive material including a non-conductive filler of about 5% by weight to about 25% by weight. The filler particles 92 in the filler material have a hardness that is harder than that of the metal material forming the bumps 96, preferably twice as high. further, The filler particles are non-conductive so that there is no electrical short between the bumps on the IC chip. The concentration of the filler in the adhesive is determined by the IC chip or substrate 9 In order to match the coefficient of thermal expansion CTE of E is high enough to reduce E and low enough not to interfere with electrical communication between the bumps on the IC chip and the bonding pads 84 on the substrate. |