abstract |
[PROBLEMS] High resolution, heat resistance, adhesion, electrical properties, thermal shock resistance, PCT resistance required for solder resists and interlayer insulating materials for printed wiring boards, and electroless plating resists An object of the present invention is to provide a photosensitive resin composition having excellent resistance and electroless plating resistance. An ester compound (A) comprising a compound having a phenolic hydroxyl group and a carboxylic acid and 0.5 to 10% by mass of a photoacid generator (B) based on the total mass of the photosensitive resin composition. A photosensitive resin composition comprising: |