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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-306
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J133-06
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filingDate 2002-05-29-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2042d9822c76bf5fb1b25b667968f1af
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publicationDate 2003-12-03-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2003342543-A
titleOfInvention Substrate connection tape and etching method using the same
abstract (57) [Problem] To provide a substrate connecting tape in which a plurality of printed boards are not separated until a resist removing step is performed when etching while connecting and transporting a plurality of printed boards. It is an object to eliminate a uniform phenomenon. In a method for etching a plurality of substrates horizontally transferred by a transfer means, a substrate connecting tape is formed by stacking at least a layer dissolved or swelled in an etching solution and a layer dissolved or swelled in a resist removing solution. The edges of the adjacent substrates in the transport direction are connected to each other, and the substrates in the connected state are transported by the transport means, and alkali development and etching are performed. A substrate etching method, wherein each substrate is separated from the substrate.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2007197744-A
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