http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2003324042-A

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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J183-04
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filingDate 2002-05-01-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4b4366c0155e278c5dc774e877c12415
publicationDate 2003-11-14-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2003324042-A
titleOfInvention Substrate bonding method
abstract (57) [Problem] To bond a substrate having minute projections to another substrate, it is possible to efficiently suppress voids generated in the adhesive, and furthermore, a substrate with good flatness accuracy. Provided is a method of bonding substrates that can be bonded. SOLUTION: A surface coating layer is formed on a convex portion of a first substrate having a convex portion formed on a surface, a plurality of spacing members are formed on the surface coating layer, and an adhesive surface of the first substrate is formed. On the opposite surface, a first adhesive film composed of a film layer and an adhesive layer is attached, and on the surface opposite to the adhesive surface of the second substrate, A second adhesive film composed of a film layer and an adhesive layer is attached, an adhesive is applied to the surface coating layer, the second substrate is placed on the adhesive, and the surface coating layer and the second substrate are disposed. Adhesion is performed.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2015135909-A
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