http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2003318299-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_f4a8faea375370b67c9d71e67db32bcd |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16225 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-02 |
| filingDate | 2002-04-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_479000e3809b0c09d2df8194604121aa |
| publicationDate | 2003-11-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2003318299-A |
| titleOfInvention | Electronic component storage package |
| abstract | (57) [Problem] To provide a highly reliable electronic component storage package that can be hermetically sealed efficiently with a lower welding current value and that does not cause cracks in an insulating substrate. . A mounting portion on which an electronic component is mounted on an upper surface. a and an insulating substrate 1 having a sealing metallization layer 6 deposited so as to surround the mounting portion 1a, and a brazing material 8 is deposited on the lower surface, and the brazing material is applied to the sealing metallization layer 6 In the electronic component storage package composed of the metal lid 2 joined by seam welding via 8, the sealing metallized layer 6 has a thickness of 4 to 8 μm, A nickel plating layer having a thickness of 8 to 20 μm is deposited on the surface. |
| priorityDate | 2002-04-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 17.