| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_294881271413951a95f284b588a68e66 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B24B53-017
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25F7-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25F3-16
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B24B53-001
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-304
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23H5-08 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23H5-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25F3-16
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-304
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24B53-007
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24B53-00 |
| filingDate |
2002-04-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c7c2244db2edb1d2c3a9dd131cc1b954
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_bddd36b0c7662f4e96d9ae446418e2c9
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0768f99c6b5da130f72d10c6f8a47abf
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b70c4bd13c0eca3ed6f853c48351485d
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_541d99c86a90b33ea9a4ba7c25223829
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_34d75607b7f01ab4a2d3dee948565ea7
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c83858dfbd89cb5849f0db652644bb02 |
| publicationDate |
2003-11-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2003311539-A |
| titleOfInvention |
Polishing method and polishing apparatus, and semiconductor device manufacturing method |
| abstract |
PROBLEM TO BE SOLVED: To provide a highly accurate polishing method and a polishing apparatus capable of easily and efficiently removing an excessive metal film when a metal film is planarized by polishing. Further, a method for manufacturing a semiconductor device using the same is provided. SOLUTION: The polishing method according to the present invention has a structure in which a substrate 17 on which a metal film is formed and a counter electrode 15 are arranged to face each other in an electrolytic solution, and a current is applied to the metal film via the electrolytic solution E and a hard electrode is formed. The metal film is polished by polishing the surface of the metal film with a pad. The polishing apparatus 11 according to the present invention is a polishing apparatus 11 for polishing a metal film formed on a substrate 17 in an electrolytic solution. A power supply 12 for applying a voltage using the substrate 17 as an anode and the counter electrode 15 as a cathode, and a polishing pad 14 for sliding on the substrate 15 to polish the metal film. It is provided with. |
| priorityDate |
2002-04-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |