| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_be055db3c1a09879df07379ba969e223 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01078 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-56
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-60
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 |
| filingDate |
2002-04-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f3811ea7b830180fd06c065cb3b9af9c |
| publicationDate |
2003-10-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2003309227-A |
| titleOfInvention |
Semiconductor device and method of manufacturing the same |
| abstract |
[PROBLEMS] To provide a semiconductor device and a method of manufacturing the same in a resin-sealed semiconductor device such as a semiconductor package, which can prevent a short circuit between terminals. SOLUTION: A main surface and a side surface 1b of a semiconductor element 1 on which a gold bump 6 is provided are a first reactive group chemically bonded to an inorganic material around a silicon atom and a second reaction chemically bonded to an organic material. The semiconductor element 1 on which the coupling material 21 is provided and the tape base 11 on which the lead wiring 9 is formed are covered with a resin. . Accordingly, it is possible to prevent moisture from entering the interface between the semiconductor element 1 and the sealing resin 7, to obtain high quality reliability, and to prevent a short circuit between the terminals of the lead wiring 9. . |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8779607-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-102295595-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8366867-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20210093594-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2019149465-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2009001773-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8597460-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2009001754-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2012004329-A |
| priorityDate |
2002-04-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |