http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2003306885-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_1374dd16777534b65ad4422333245af8 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-03 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/D21H13-26 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/D21H27-12 |
| filingDate | 2002-04-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0e157cce7c46f6e9578b84d93c46cbd4 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5ff4697ae6cbd7fab3e81f7cd0029d50 |
| publicationDate | 2003-10-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2003306885-A |
| titleOfInvention | Heat-resistant thin paper, prepreg comprising the same, and laminate for printed circuit board |
| abstract | PROBLEM TO BE SOLVED: To provide a novel printed circuit board laminate having extremely low durability with little damage to a surface coating even under severe use conditions and aging, and to form the printed circuit board laminate. To provide a prepreg and a heat-resistant thin paper that can be suitably used for the prepreg. SOLUTION: The heat-resistant thin paper mainly comprising a short fiber made of an aromatic polyamide having a single fiber fineness of 0.85 dtex or less, an organic resin binder, and a pulp obtained by fibrillating an aromatic polyamide fiber, The heat-resistant thin paper has a thickness of 45 μm or less and a basis weight of 40 g / m 2. It is as follows. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2008032073-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11427962-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11649588-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2014501858-A |
| priorityDate | 2002-04-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 23.