| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_2c5561203784cbc604a4f34191a88204 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-24
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-32
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-52
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-42 |
| filingDate |
2002-04-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3fee399af8dabd2f22fc90b70f2f3596
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1ffd226dfc6a7b96b7516b530722fde3
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a4bf88f8ca341034dc7f3369ef4aa3bc
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_03d15ffbac6280c464b23bff2c5b11ef
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f4e7a7664aadaa60bb56d547c8473c94 |
| publicationDate |
2003-10-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2003301270-A |
| titleOfInvention |
Electroless gold plating method |
| abstract |
(57) [Problem] To provide means capable of forming an electroless gold plating film having excellent characteristics such as solder bonding strength on an electroless nickel plating film. SOLUTION: This is a method of performing electroless gold plating on an electroless nickel plated object to be plated, wherein i) the object to be plated is immersed in a substitution precipitation type electroless gold plating solution, and ii) the object to be plated is Iii) An electroless gold plating method characterized by immersing again in a substitution deposition type electroless gold plating solution after washing with water. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2009191285-A |
| priorityDate |
2002-04-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |