http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2003301161-A

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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J113-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J109-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J167-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J163-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J7-02
filingDate 2002-04-09-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3a939b769c74e5c6e19c805db75736c3
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f5768992d92a13e3cd5d53890b3471bc
publicationDate 2003-10-21-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2003301161-A
titleOfInvention Photocurable adhesive composition and photocurable adhesive sheet
abstract (57) [Summary] [PROBLEMS] To exhibit excellent pressure-sensitive adhesiveness (adhesiveness) at room temperature, and rapidly cure at room temperature by irradiating light to exhibit excellent adhesive strength and heat resistance. Provided is a photocurable adhesive composition and a photocurable adhesive sheet using the same. The photocurable adhesive composition comprises a polyester resin, a cationic photopolymerizable compound, a modified CTBN epoxy resin, and a cationic photopolymerization initiator, wherein 100 parts by weight of the polyester resin is used. On the other hand, 1 to 50 parts by weight of the CTBN modified epoxy resin is added, and a photocurable adhesive composition, A photocurable pressure-sensitive adhesive sheet, comprising the photocurable pressure-sensitive adhesive composition.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-1634921-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2006027139-A1
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