http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2003298229-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_040b8ace0353c32f51bd886f5c357936 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-38 |
| filingDate | 2002-03-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a7f421f8bbde1a7daafd1a7ed857dd8d |
| publicationDate | 2003-10-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2003298229-A |
| titleOfInvention | Copper foil for printed wiring board and method for producing the same |
| abstract | (57) [Summary] [PROBLEMS] To be soluble in an alkali etching solution, Further, a copper foil for a printed wiring board excellent in chemical resistance and heat resistance and a method for producing the same. SOLUTION: At least one surface of the copper foil has a cobalt and / or nickel layer containing germanium, And a copper foil for a printed wiring board, characterized by having a chromate film layer on the layer and further applying a silane coupling agent layer on the chromate film layer, and an electrolytic solution containing germanium and cobalt and / or nickel. After performing a cathodic electrolysis of a copper foil in the electrolytic solution using a liquid to form a cobalt and / or nickel layer containing germanium, a chromate film layer is provided on the layer, and a silane coupling agent is further provided on the layer. A method for producing a copper foil for a printed wiring board, comprising providing a layer. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2009116426-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-112639170-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I404835-B |
| priorityDate | 2002-03-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 61.