http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2003294788-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c1755eede76ea7e719a3e0d2843cd793 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01R1-073 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01R1-067 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01R1-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01R31-26 |
| filingDate | 2002-04-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a271e9faf181092b4d9d43de7ef4e3a4 |
| publicationDate | 2003-10-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2003294788-A |
| titleOfInvention | Connection sheet for tester head |
| abstract | (57) [Summary] [PROBLEMS] To inspect the electrical characteristics of a semiconductor product with solder balls using a conventional inspection device, interpose the solder balls and the tester head between the solder balls and the tester head. Provided is a connection sheet for a tester head used for performing an inspection without directly contacting the test piece. SOLUTION: A plurality of solder balls 5 are provided between a solder ball 5 of a semiconductor product and a tester head 1 of an inspection device to electrically connect them, and contact a solder ball 2 with a sheet base 61. Tester head connection sheet 6 on which conductive particles 5 are arranged. |
| priorityDate | 2002-04-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 17.