| abstract |
(57) [Problem] To provide a cleaning agent which does not corrode wiring materials in cleaning performed after flattening processing of wiring of semiconductor devices with copper or the like. SOLUTION: The cleaning agent contains a cyclic amine such as a piperazine and / or a morpholine and an ethyleneamine, and the piperazine includes piperazine, N- Methylpiperazine, N, N′-dimethylpiperazine, hydroxyethylpiperazine, N-methyl-N′-hydroxyethylpiperazine, aminoethylpiperazine, N ′, N′-trimethylaminoethylpiperazine, The morpholines include morpholine, N-methylmorpholine, hydroxyethylmorpholine, aminoethylmorpholine, N, N-dimethylaminoethylmorpholine and the like, and the ethyleneamines include ethylenediamine, diethylenetriamine and the like. |