| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b19eaa8e535da4e4bceed99917a68153 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-14 |
| filingDate |
2002-03-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8bf27b15f969ca035ab9b706a455dbe2
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6786839703a9acc427daa1f96ce7eb10 |
| publicationDate |
2003-10-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2003292737-A |
| titleOfInvention |
Liquid sealing resin and semiconductor device using the same |
| abstract |
(57) [Problem] To provide a liquid sealing resin and a semiconductor device having both low stress property and bump protection property. SOLUTION: Epoxy resin, curing agent containing active hydrogen, A liquid sealing resin having 1.2 <a / b <4 when imidazoles and inorganic fillers are the main components, the total number of epoxy groups of the epoxy resin is a, and the number of active hydrogens of the curing agent is b. Is a liquid sealing resin composed of an epoxy resin having an aliphatic glycidyl group and an epoxy resin having an aromatic glycidyl group. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2020194325-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2010526907-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2017197620-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I422932-B |
| priorityDate |
2002-03-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |