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publicationDate 2003-10-15-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2003292733-A
titleOfInvention Dielectric filler-containing resin for forming a built-in capacitor layer of a printed wiring board, double-sided copper-clad laminate having a dielectric layer formed using the dielectric-filler-containing resin, and method for producing double-sided copper-clad laminate
abstract (57) [Summary] A dielectric layer of a double-sided copper-clad laminate used for forming a built-in capacitor layer can be formed to any thickness without a skeletal material. And it aims at provision of what has high intensity | strength. An epoxy resin (including a curing agent) in an amount of 20 to 80 parts by weight, an aromatic polyamide resin polymer soluble in a solvent in an amount of 20 to 80 parts by weight, and a curing accelerator added in an appropriate amount as necessary. And average particle diameter D IA is a 0.1 to 1.0 [mu] m, 0.2 to the weight cumulative particle diameter D 50 by laser diffraction scattering particle size distribution measurement method 2.0 μm and D 50 / D using the weight cumulative particle diameter D 50 and the average particle diameter D IA obtained by image analysis. For forming a built-in capacitor layer of a printed wiring board obtained by mixing a dielectric filler which is a dielectric powder having a perovskite structure having a substantially spherical shape and a value of cohesion degree represented by IA of 4.5 or less. By using a resin containing a dielectric filler.
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