| abstract |
PROBLEM TO BE SOLVED: To provide a thermosetting resin composition, an epoxy resin molding material, and a quick-curing property, a high fluidity, a good solder crack resistance, and a moisture resistance reliability. A semiconductor device is provided. Kind Code: A1 A thermosetting composition comprising a compound (A) having two or more epoxy groups in one molecule, a compound (B) having two or more phenolic hydroxyl groups in one molecule, and a phosphonium compound (C) as essential components. A resin composition, an epoxy resin molding material containing the same, and a semiconductor device sealed with the cured product. |