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filingDate 2002-03-29-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5a8c1fdd69b965c29b9891ccaba75865
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publicationDate 2003-10-10-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2003286596-A
titleOfInvention Copper foil suitable for laser drilling and its manufacturing method
abstract (57) [Summary]nPROBLEM TO BE SOLVED: To drill a laser by direct laser beam irradiation Copper foil used in the manufacture of printed wiring boards And achieve both laser drilling and soft etching It was difficult to do.nThe copper foil has a thickness of 18 μm or less, and is made of a resin. Laser surface that is different from the surface to be adhered to the substrate Copper, nickel and molybdenum Having a copper alloy layer comprising: It is a copper foil for drilling. In the present invention, contained in the copper alloy layer Nickel is 50 μg / dm 2 To 500 μg / d m 2 And molybdenum is 30 μg / dm. 2 From 300 μg / dm 2 It is. In addition, the present invention relates to copper and nickel Using copper and molybdenum plating solution Of copper foil for laser drilling characterized by performing drilling Is the way.
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http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7816015-B2
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http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2009026912-A
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Total number of triples: 45.