| abstract |
(57) [Problem] To provide an organometallic compound capable of easily forming an electrically conductive metal pattern by exposure. A M m L n L 'o X p ( where, M is Ag, A u, Co, Cu, Pd, Ni, Pt, one kind of transition metal selected from the group consisting of Zn and Cd, L and L ′ are organic ligands of a specific structure, X is an anionic ligand, m is 1 N is an integer of 1 to 10, o is an integer of 0 to 10, and p is an integer of 0 to 10. ) Is an organometallic compound for forming a metal pattern. The organic ligand constituting the organometallic compound of the present invention is sensitive to light and has the property of being easily separated from the central metal and decomposed during exposure, so that a separate photosensitive resin coating is applied when forming a metal pattern. No patterning and etching steps are required, and the patterning time can be reduced. |