http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2003283110-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_f4a8faea375370b67c9d71e67db32bcd |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-16152 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16225 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-15174 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-32 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-18 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-09 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-24 |
| filingDate | 2002-03-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2e03a61e2ac39236c67b3b14ffaa6e25 |
| publicationDate | 2003-10-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2003283110-A |
| titleOfInvention | Wiring board and method of manufacturing the same |
| abstract | (57) [Summary] [Problem] This is a wiring board which does not contain lead in a plating metal layer, does not cause functional defects such as spot-like discoloration, and has high adhesion to a plating film. Provided is a wiring board that does not harm the human body. SOLUTION: The wiring board 4 is formed by forming a wiring conductor 2 made of a high melting point metal on an insulator 1 and applying an electroless plating metal layer 6 on the surface of the wiring conductor 2, the electroless plating metal layer being provided. Numeral 6 contains a platinum group element 8 as metal particles therein and contains no lead, and metal particles of the platinum group element 8 are distributed on the surface of the wiring conductor 2 at a nuclear density of 10 to 200 nuclei / μm 2. are doing. Since it does not contain lead, it does not harm the human body, and the nucleus density of the metal particles of the platinum group element 8 is appropriately set to 10 to 200 nuclei / μm 2 , so that the electroless plating metal layer 6 is initially deposited. Can be a dense, high-density, defect-free, uniform and highly adherent film. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2007088748-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-4526270-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2005200732-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-4699225-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2007207914-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8071187-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2007126743-A |
| priorityDate | 2002-03-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 52.