| abstract |
PROBLEM TO BE SOLVED: To provide a high-sensitivity coating film having excellent dryness to the touch, adhesion and resolution, little gas generation during heat curing, and excellent thermal shock resistance and PCT resistance. Alkali-developable photosensitive resin composition, and a print produced using the same, on which a solder resist and / or resin insulation layer having reduced gas generation during component mounting and excellent in crack resistance, electrical insulation properties, etc. is formed. Provide a wiring board. SOLUTION: The alkali-developable photosensitive resin composition comprises: (A) a carboxyl group-containing resin having one or more carboxyl groups in one molecule, (B) at least one compound represented by the following general formula (I) as a photopolymerization initiator, It contains (C) a reactive diluent, and (D) an epoxy compound having two or more epoxy groups in one molecule. Embedded image |