http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2003277588-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_5547f741b25666fc4ae5195cf71a979b |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-03 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B15-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-62 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08J5-24 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-3492 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-36 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-20 |
| filingDate | 2002-03-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_19612d5a4132b99cd7484f76475c6072 |
| publicationDate | 2003-10-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2003277588-A |
| titleOfInvention | Thermosetting resin composition and laminate using the same |
| abstract | (57) [Summary] [PROBLEMS] To provide a thermosetting resin composition which simultaneously achieves unprecedented high levels of flame retardancy and chemical resistance. In particular, in a thermosetting resin composition used for manufacturing a laminated board or a printed wiring board, various physical properties required for the laminated board or the wiring board, such as adhesion to metal, heat resistance (solder heat resistance, While maintaining good glass transition temperature) and dielectric properties, it imparts high flame retardancy and chemical resistance. A thermosetting resin composition containing an inorganic filler (a) as an essential component and a compound (B) having a nitrogen atom and an oxygen atom in a resin structure of a cured product. In particular, the inorganic filler (a) is a thermosetting resin composition containing silica, or the inorganic filler (a) is a thermosetting resin composition containing a metal hydroxide (A). In particular, the thermosetting resin composition is a compound (B) having a nitrogen atom and an oxygen atom, which is an isocyanuric acid derivative having a reactive functional group. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2009215390-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2014109027-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2010235924-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2017098379-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2014028981-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2010144141-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10465089-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2010106125-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9265145-B2 |
| priorityDate | 2002-03-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 168.