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publicationDate 2003-09-30-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2003275892-A
titleOfInvention Lead-free solder alloy and solder paste composition
abstract (57) [Summary] [PROBLEMS] To reduce the probability that, when inspecting a soldering defect after reflow soldering with an image inspection device, a portion that looks blackish in a solder fillet other than the soldering defect will be reduced. Matting is performed to reduce gloss and increase the number of irregularly reflected whitish parts so that soldering defects can be reliably and accurately inspected. For example, a lead-free solder alloy in which trace amounts of Bi and Sb are added as an element that generates a matte component that reduces metallic luster in a Sn-Ag-Cu-based lead-free solder alloy. Solder paste using this.
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